Tokyo, Japan - April 24, 2018- TOOL Corporation (headquarters in Meguro-ku, Tokyo Japan, president Hiromu Abiki; hereafter referred to as TOOL) has extended "HAMAMATSU-CADNavi", CAD navigation function which links TOOL's "LAVIS-plus®", IC design visual verification tool, with "emission microscope PHEMOS®-1000" and "inverted emission microscope iPHEMOS-MP and iPHEMOS-DD", semiconductor failure analysis system (hereafter referred to as system) manufactured by Hamamatsu Photonics K.K. (hereafter referred to as Hamamatsu Photonics), and has released "HAMAMATSU-IF Suite". In addition to the conventional CAD navigation function which superimposes observation images obtained by the system onto design data and displays them in the LAVIS-plus view for alignment, HAMAMATSU-IF Suite has "EASY-S" which enables you to extract nets and adjacent places.

With semiconductor failure analysis, fault sites are localized by superimposing signals obtained by different failure analysis methods including emission analysis, thermal analysis, IR-OBIRCH analysis, DALS analysis, and EO probing analysis on design data information. This analysis critically requires a CAD navigation which links the system and IC design visual verification tool. Moreover, the analysis requires high-speed display and expressive drawing according to analysis conditions with the scaling and miniaturization of devices.

HAMAMATSU-IF Suite uses LAVIS-plus whose strongest point is high-speed loading and display of large-scale data as the interface with the system to satisfy these requirements. In addition, HAMAMATSU-IF Suite enables effective and efficient alignment of observation images and design data by displaying multiple superimposed observation images, providing highly precise positioning considering different factors of error, and allowing you to first performing alignment with a low-magnification image and replacing the image with a high-magnification image at any time.

A function for extracting nets and adjacent places that is installed on "EASY-S" can narrow down nets in LEF/DEF data and GDSII and OASIS format design data from signals obtained by failure analysis methods, which can maximize these work efficiencies as a function suitable for identifying failure locations.

In addition, you can use standard LAVIS-plus functions including customization with the API and display of failure analysis results to link information obtained with other failure analysis methods with the data obtained with HAMAMATSU-IF Suite.

A demonstration environment of HAMAMATSU-IF Suite is available at Application Laboratory in Joko Factory of Hamamatsu Photonics. Try out the state-of-the-art functions and performance with your chips and design data.

About the PHEMOS^(R)-1000 series and iPHEMOS series

The PHEMOS-1000 series and iPHEMOS series are emission microscopes designed to identify failure locations by detecting reactions caused by defects in semiconductor devices and reactions involved with device operation. These series support any types of products including memory, logic, power, and flat panel devices.

About LAVIS-plus^(R)

LAVIS-plus is an "IC design visual verification tool" that has a viewer function capable of loading and displaying large data at ultrahigh speed, analyzes electric characteristics, displays verification errors, and allows you to use it as a simple editor. LAVIS-plus is highly interoperable with other vendors' tools, so you can use LAVIS-plus in all processes including design, verification, mask data preparation, inspection, and failure analysis.

Contact

Hamamatsu Photonics K.K.
Failure Analysis Systems
Business Promotion 2nd Department
Systems Divsion
Shinsuke Suzuki
+81-053-431-0150
sales@sys.hpk.co.jp

TOOL CORPORATION
Corporation Marketing
Asako Nakane
+81-3-5723-8144
marketing@tool.co.jp